Products

PI2545

Top
Products

PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material. The cured film exhibits heat resistance of 400℃ or higher. Although this product does not have photosensitivity, it is possible to form patterns using a positive photoresist process using a positive photoresist and an aqueous solution of TMAH.

Features
Product features
Application
SDS data sheet
Related products

Features

Compatible with wet etching processes

Although PI2545 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.

Excellent heat resistance

PI2545 has high heat resistance. It is designed so that the glass transition temperature reaches 400℃ after forming the cured film, making it suitable for high temperature environments.

Low CTE

PI2545 shows a lower coefficient of thermal expansion than general polyimide. It shows 13ppm/℃ under standard condition and suppresses mismatch with inorganic film.

Product features

High heat resistance non-photosensitive polyimide

Photodefineable: non-photosensitive polyimide

Developer: -

Cure temperature: 250-375℃

Thickness: 1-3 μm

NMP free: -

Resolution (5 µmt): -

Modulus: 2.3 GPa

Elongation: 100%

Tensile strength: 260 MPa

Tg: over 400 ℃

CTE: -

Td5: 580 ℃

Application: Stress buffer

Application

Stress buffer layer

We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.

SDS data sheet

化学品の危険有害性、組成および成分情報、取り扱いに関する情報などを記載しております。
アルミニウムおよびアルミニウム合金の圧延品（板、条、管、棒、線、押出形材）全般に関するSDSを通知致します。