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HD7110

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HD7110 series are wide range curable and solvent developable Nega-tone type Polyimide precurcer. This product based on Industrial standard HD4100series. Low temperature curing is effective in reducing wafer stress and warpage. The HD7110 achieves high flatness, high insulation reliability, and high resolution and is effective for forming high-density design used in advanced packages. It can also be used for general stress buffer applications.

Features
Product features
Application
SDS data sheet
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Features

Achieves high flatness for multi layer

HD7110 is a product with higher embedded flatness than conventional polyimide products. Achieves high surface flatness when forming multilayer or when there is a substrate structure.

High insulation reliability

HD7110 shows high insulation reliability after curing. It can be used as an insulating film for high-density IC Package design, and can maintain its resistance value even after conducting a bias-HAST test at L/S 2μm/2μm for 168 hours.

Achieve high resolution

The HD7110 is capable of high resolution patterning. This product is a high resolution product that can form a via pattern of 5μm.

Maintains high copper adhesion in reliability tests

HD7110 shows high adhesion to copper substrates. This product coated and cured on Cu does not delaminate from copper even after accelerated reliability tests such as PCT condition.

Product features

High Reliability Low temp curable Nega-tone Polyimide

Photodefineable: Negative-tone Photodefinable Polyimide

Developer: Cyclopentanone

Cure temperature: 200-300℃

Thickness: 5-12 μm

NMP free: NMP free

Resolution (5 µmt): 5 μm

Modulus: 2.8-3.3 GPa

Elongation: 40%

Tensile strength: 160-190 MPa

Tg: 230 ℃

CTE: -

Td5: 310-350 ℃

Application: Redistribution layer

Application

Redistribution layer

In mobile devices, etc., represented by smartphones and wearables, solder or copper bump bonding technology and multi-layer interconnection technology are utilized to increase packaging density. In this application, our products with high resolution and compatibility with dissimilar materials enable smaller devices and higher reliability. In this field, we have been releasing environment-friendly products that are compatible with even devices with structures or characteristics that limit process temperature, thereby contributing to progress in PKG processes.

SDS data sheet

化学品の危険有害性、組成および成分情報、取り扱いに関する情報などを記載しております。
アルミニウムおよびアルミニウム合金の圧延品（板、条、管、棒、線、押出形材）全般に関するSDSを通知致します。