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PI2525

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PI2525 undergoes imidization even at low temperatures, making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃. It is generally used as a stress buffer and insulating film for semiconductor packages. By pre-treating the substrate with an adhesion agent, it exhibits high adhesion to silicon substrates and metals.

Features
Product features
Application
SDS data sheet
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Features

Compatible with wet etching processes

Although PI2525 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.

Low temp curable

PI2525 can be cured at lower temperatures than other non-photosensitive PIs. Even at low temperatures, the polyimide precursor forms polyimide and exhibits its properties.

Excellent room temperature storage stability

PI2525 shows very good storage stability. Viscosity changes are small when stored at room temperature, and changes in coating film thickness can be suppressed.

Product features

Low temp curable non-photosensitive Polyimide

Photodefineable: non-photosensitive polyimide

Developer: -

Cure temperature: 250-350℃

Thickness: 6-12 μm

NMP free: -

Resolution (5 µmt): -

Modulus: 3.3 GPa

Elongation: 40%

Tensile strength: 130 MPa

Tg: 310 ℃

CTE: -

Td5: 560 ℃

Application: Stress buffer

Application

Stress buffer layer

We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.

SDS data sheet

化学品の危険有害性、組成および成分情報、取り扱いに関する情報などを記載しております。
アルミニウムおよびアルミニウム合金の圧延品（板、条、管、棒、線、押出形材）全般に関するSDSを通知致します。