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HD7204

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HD7204 is an NMP-free solvent-developable negative photosensitive polyimide precursor that reduces the NMP content in the product to below the REACH regulation value in order to comply with environmental regulations. It supports a wide range of curing temperatures (200-300), and low-temperature curing is effective in reducing wafer stress and warpage. The HD7204 achieves high flatness and high resolution when forming multilayer structure, and is effective for forming high-density design used in advanced packages.

Features
Product features
Application
SDS data sheet
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Features

Achieves high flatness for multi layer

HD7204 is a product with higher embedded flatness than conventional polyimide products. Achieves high surface flatness when forming multilayer or when there is a substrate structure.

REACH compliant NMP-free priduct

HD7204 is an NMP-free, solvent-developable negative photosensitive polyimide precursor that reduces the NMP content in the product to below the regulation value in compliance with the EU's chemical substance regulations.

Achieve high resolution

HD7204 is capable of high resolution patterning. This product is a high resolution product that can form a via pattern of 6μm.

High elongation

HD7204 shows the highest elongation among our solvent-developable negative photosensitive polyimides.

Product features

REACH Compliant NMP Free Nega-tone Polyimide

Photodefineable: Negative-tone Photodefinable Polyimide

Developer: Cyclopentanone

Cure temperature: 200-300℃

Thickness: 5-15 μm

NMP free: -

Resolution (5 µmt): 6 μm

Modulus: 2.5-2.9 GPa

Elongation: 50%

Tensile strength: 180-210 MPa

Tg: 200-230℃

CTE: -

Td5: 310-340 ℃

Application: Redistribution layer

Application

Redistribution layer

In mobile devices, etc., represented by smartphones and wearables, solder or copper bump bonding technology and multi-layer interconnection technology are utilized to increase packaging density. In this application, our products with high resolution and compatibility with dissimilar materials enable smaller devices and higher reliability. In this field, we have been releasing environment-friendly products that are compatible with even devices with structures or characteristics that limit process temperature, thereby contributing to progress in PKG processes.

SDS data sheet

化学品の危険有害性、組成および成分情報、取り扱いに関する情報などを記載しております。
アルミニウムおよびアルミニウム合金の圧延品（板、条、管、棒、線、押出形材）全般に関するSDSを通知致します。