HD8820 is an alkaline-developable Posi-tone PBO precursor. It has excellent mechanical properties and heat resistance, and is widely used as a stress buffer and packaging material. In addition, it has several excellent properties for protecting Cu wiring, such as low water absorption and excellent dielectric properties.
HD8820 is an alkaline-developable Posi-tone PBO precursor. It has excellent mechanical properties and heat resistance, and is widely used as a stress buffer and packaging material. In addition, it has several excellent properties for protecting Cu wiring, such as low water absorption and excellent dielectric properties.
Industrial standard Posi-tone product
HD8820 is an alkaline-developable Posi-tone PBO precursor. It has excellent mechanical properties and heat resistance, and is widely used as a stress buffer and packaging material.
High heat resistance
HD8820 series has high thermal resistance. This product show high Tg and has resistance to environments of 250-350°C after forming a cured film.
High Elongation
HD8820 shows a high elongation at break and exceeding 100% when formed at standard condition(320℃).
Low water absorption
HD8820 uses a PBO precursor and shows lower water absorption than general polyimide. The absorbance of HD8820 film formed under standard conditions is 0.5%.
High reliability Posi-tone PBO
Stress buffer layer
We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.
Redistribution layer
In mobile devices, etc., represented by smartphones and wearables, solder or copper bump bonding technology and multi-layer interconnection technology are utilized to increase packaging density. In this application, our products with high resolution and compatibility with dissimilar materials enable smaller devices and higher reliability. In this field, we have been releasing environment-friendly products that are compatible with even devices with structures or characteristics that limit process temperature, thereby contributing to progress in PKG processes.
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