HD4100 series are solvent developable Nega-tone type Polyimide precurcer. HD4100 serie show excellent mechanical and thermal film properties and chemical resistance in process. Also HD4100 series has good adhesion to underfil and metal. This series widely applied stress buffer and IC-Package.

HD7204 is an NMP-free solvent-developable negative photosensitive polyimide precursor that reduces the NMP content in the product to below the REACH regulation value in order to comply with environmental regulations. It supports a wide range of curing temperatures (200-300), and low-temperature curing is effective in reducing wafer stress and warpage. The HD7204 achieves high flatness and high resolution when forming multilayer structure, and is effective for forming high-density design used in advanced packages.

HD7110 series are wide range curable and solvent developable Nega-tone type Polyimide precurcer. This product based on Industrial standard HD4100series. Low temperature curing is effective in reducing wafer stress and warpage. The HD7110 achieves high flatness, high insulation reliability, and high resolution and is effective for forming high-density design used in advanced packages. It can also be used for general stress buffer applications.

HD8820 is an alkaline-developable Posi-tone PBO precursor. It has excellent mechanical properties and heat resistance, and is widely used as a stress buffer and packaging material. In addition, it has several excellent properties for protecting Cu wiring, such as low water absorption and excellent dielectric properties.

In order to comply with environmental regulations, HD8930 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value. It can be cured at low temperatures (200-250°C), and the film after curing exhibits high elongation. It can be used as a packaging material that takes advantage of the high resolution of positive materials.

In order to comply with environmental regulations, HD8961 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value. Same as HD8930, it can be cured at low temperatures (200-250°C), and the cured film shows high adhesion to copper and is highly resistant to the chemicals used in the semiconductor manufacturing process. It can be used as a packaging material that takes advantage of the high resolution of positive materials.

HD3000series is REACH compliant NMP free non photosensitive polyimide precursor. While maintaining the high heat resistance and high chemical resistance of polyimide, it expresses thermoplasticity. The cured film works as a temporary bonding material between wafers and wafers, between wafers and chips, etc., and can withstand heat treatment at high temperatures and exposure to chemicals. After bonding, it can be easily removed by using laser or solvent.

PIX-1400/3400 are non-photosensitive polyimide precursors with self-adhesive properties to SiN, SiON, and SiOx. PIX series can protect the passivation layer and metal layer by applying it on the IC chip surface. This product does not have photosensitivity, it is possible to form patterns using a positive photoresist process using a positive photoresist and an aqueous solution of TMAH.

PI2525 undergoes imidization even at low temperatures, making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃. It is generally used as a stress buffer and insulating film for semiconductor packages. By pre-treating the substrate with an adhesion agent, it exhibits high adhesion to silicon substrates and metals.

PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material. The cured film exhibits heat resistance of 400℃ or higher. Although this product does not have photosensitivity, it is possible to form patterns using a positive photoresist process using a positive photoresist and an aqueous solution of TMAH.

The PI2600 series is a non-photosensitive polyimide precursor that forms a resin film with a high modulus and low coefficient of linear thermal expansion (CTE) to form a very rigid polyimide after curing. Therefore, it is possible to reduce wafer stress after curing. Patterning can be done by dry etching or laser ablation.