2022
6-Oct
25th anniversary Ceremony was held for the 25th anniversary of foundation.
1-Apr
Relocation of HDMJ Headquarters HD MicroSystems, Ltd. (HDMJ) Headquarters was relocated from Iidabashi to Shinjuku.
2021
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Release of HD7000 series Low-temperature curable solvent developable photosensitive PI was developed.
2020
1-Aug
Change of company name Company name was changed to HD MicroSystems, Ltd.
2017
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20th anniversary Ceremony was held for the 20th anniversary of foundation.
2016
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Completion of new Development Building HDMJ development site was relocated to new Development Building.
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Completion of new clean room in Parlin Site, the U.S. Clean room facilities in Parlin Site, the U.S. were expanded.
2015
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Establishment of Taiwan Laboratory Local laboratory was established.
2013
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Establishment of Product Stewardship system Global PS (Product Stewardship) Group was established.
2009
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Release of HD8900 series Low-temperature curable alkali positive photosensitive PBO was developed.
2008
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Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Koishikawa to Korakuen.
2007
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Release of HD3000 series Highly heat-resistant temporary adhesive material was developed.
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10th anniversary Ceremony was held for the 10th anniversary of foundation.
2004
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Release of HD4100 series Cu redistribution photosensitive polyimide material was developed.
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Release of HD8800 series Highly sensitive alkaline positive photosensitive PBO was developed.
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Launch of business in the field of packaging Business was expanded to the packaging market in Taiwan.
2003
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Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Shibuya to Koishikawa.
2000
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Release of HD8000 series Alkaline positive photosensitive polyimide material was developed.
1999
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Commencement of operations of new factory in the U.S. New factory in Parlin Site in New Jersey, the U.S. commenced operations.
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Establishment of HDME Hitachi Chemical DuPont MicroSystems GmbH (currently HD MicroSystems GmbH, HDME ) was established in Germany as a 100% subsidiary of Hitachi Chemical DuPont MicroSystems, L.L.C.(HDMA).
1998
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Release of HD4000 series High-Tg photosensitive polyimide material for flip chips was developed.
1997
1-Nov
Launch of business on November 1 HDMA and HDMJ started business. Osaka office was opened.
7-Aug
Establishment of HDMJ HDMJ was established in Japan.
6-Aug
Establishment of HDMA The founding parent company, HDMA, was established in the U.S.
Sales of the products taken over from the parent companies started.