HD4100 series are solvent developable Nega-tone type Polyimide precursor.

HD7110 is a wide range temperature curable and solvent developable Nega-tone type Polyimide precursor.

HD7204 is an NMP-free solvent-developable negative photosensitive polyimide precursor that reduces the NMP content in the product to below the REACH regulation value in order to comply with environmental regulations.

HD8820 is an alkaline-developable Posi-tone PBO precursor.

HD8930 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value.

HD8961 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value.

HD3000series is REACH compliant NMP free non photosensitive polyimide precursor.

PIX-1400/3400 are non-photosensitive polyimide precursors with self-adhesive properties to SiN, SiON, and SiOx.

making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃.

PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material.

The PI2600 series is a non-photosensitive polyimide precursor that forms a resin film with a high modulus and low coefficient of linear thermal expansion (CTE) to form a very rigid polyimide after curing.