Uses & Applications
HD MicroSystems products have traditionally been used as stress buffers / passivation layers over semiconductor circuitry. Most recently, they have become the industry standard in flip chip and bond pad redistribution applications. There is also a growing interest in using these polymers as high temperature adhesives for wafer bonding and 3D applications and in MEMs applications.
In other industries, they have also been used as dielectric films in a wide range of applications on wire, fiber optics, quartz capillaries, circuit innerlayers, planarization and gap filling.
Stress Buffer / Passivation Layers
Flip Chip, C-4 & Redistribution Layers
High Temperature Adhesives
Fiber Optic & Quartz Capillary Coatings
|* Requires the use of an adhesion promoter
† Solvent Negative requires developer and rinse ancillary products. Typical use is 20:1 ratio, developer to polyimide.
Note: HDM is limiting the availability of small volume orders to our most popular products in each product category. Contact HDM Customer Service if you are interested in a product not listed.