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Techncial Info

Welcome to the HD MicroSystems™ technical information library.

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Technical Papers from the Symposium on Polymers

  • HD4004 PSPI Manufacturing, Integration and CPI Qualification by R. Volant, IBM
  • Evaluation of HD4004 Photosensitive Polyimide for Semiconductor Applications by T. Daubenspeck, IBM
  • Integration of a High Tg PSPI, HD4004, for 300mm Wafer Finishing for all Package Types by K. Larson, IBM
  • Design and Material Integration for an Advanced Wafer-Level Chip Scale Package by G. Rhine, Unitive
  • HD-4000 Profile Optimization Through Process Enhancement by S. Dunn, HD MicroSystems

Other Technical Papers

  • IEIEC Article on Moisture Resistance of Polyimide and BCB
  • Advanced Packaging Article Introducing HD-4000 Series
  • Solid State Technologies Article on Delphi Automotive Applications

Technical Bulletins

  • Product Selector Guide
  • Shelf Life
  • Packaging and Shipping
  • Technical Service Facility

Product Bulletins

PhotodefineableNon-photodefinableAncillary Products
HD-4100 Series
HD-8820
HD-8930 		PI-2525, PI-2555, PI-2556 & PI-2574
PI-2545
PI-2562
PI-2600 Series
PI-5878G		PA-400 Series
T-9038
VM-651
VM-652

Material Safety Data Sheets

Photodefineable Non-photodefinable Ancillary Products
HD-4100
HD-4104
HD-4110
HD-8820
HD-8921		 PI-2525
PI-2545
PI-2555
PI-2556
PI-2562
PI-2574
PI-2610
PI-2611
PI-5878G		 PA-400D
PA-400R
PA-410D
T-9038
VM-651
VM-652

To download one of the documents above, you must complete a short one-time registration form. Once you have completed the registration you will arrive at our document library.
If you can't find what you're looking for here, please either submit a technical question or contact a local regional representative.

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