HD-8930
Photodefineable, positive, aqueous
| Application: Stress Buffer, Packaging Features: Low Cure |
This new offering is the latest in the HD‑8900 low-cure series and combines the proven reliability of PBO technology with curing temperatures as low as 200°C. The new polymer backbone provides superior chemical resistance, thermal and mechanical properties. HD‑8930 is available for sampling late third quarter this year.
HD-8930, Cured Film Thickness 5 – 10µm
For further information, contact us or your local HD MicroSystems Technical Representative