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Hitachi Chemical


Photodefineable, positive, aqueous

Application: Stress Buffer, Packaging
Features: Low Cure

This new offering is the latest in the HD‑8900 low-cure series and combines the proven reliability of PBO technology with curing temperatures as low as 200°C.  The new polymer backbone provides superior chemical resistance, thermal and mechanical properties.  HD‑8930 is available for sampling late third quarter this year. 

HD-8930, Cured Film Thickness 5 – 10µm

For further information, contact us or your local HD MicroSystems Technical Representative 

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