HD-8900
Photodefineable, positive, aqueous
| Application: Stress Buffer, Packaging Features: Low Cure |
This product is an experimental product designed to cure at temperatures below 250°C. Testing and qualifications are underway at some major customers prior to general availability.
Applications are anticipated in coating temperature sensitive memory devices and substrates.
Please check for updates and further information in the weeks to come.
NOTE: These materials use TMAH as an aqueous developer. TMAH is not supplied by HD MicroSystems™.