Photodefineable, positive, aqueous
Application: Stress Buffer, Packaging
Features: Low Modulus, High Elongation, Low Moisture Uptake
This product is the latest technology for semiconductor stress buffer and packaging applications. It is positive acting for high resolution and develops using aqueous chemistries for lower total process costs.
Cured films have good mechanical and thermal properties to hold up in the most demanding applications. Low moisture uptake and good dielectric properties protect vital circuitry.
NOTE: These materials use TMAH as an aqueous developer. TMAH is not supplied by HD MicroSystems™.