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Hitachi Chemical

PI-2525, PI-2555, PI-2556,
PI-2574

Non-photodefineable, dry etch

Application: Inner Layer Dielectric, Fiber Coating
End Use: Rapid, Low Temp Cure 

These polyimides are suitable for applications where the high cure temperatures typically used for polyimides (350°C) cause problems. These polyimides imidize faster and at lower temperatures (200°C) than standard polyimide precursors.

Typical applications for these materials are as stress buffer or interlayer dielectric layers over low temperature substrates. They are also effective for fiber optic and quartz capillary coatings on glass drawing lines due to their rapid cure rate.

  • PI-2525 – Cured Film, thickness 5 – 13µm
  • PI-2555 – Cured Film, thickness 2 – 4 µm
  • PI-2556 – Cured Film ,thickness 0.8 – 1.5µm
  • PI-2574 – Cured Film, thickness 5 – 13µm. This material has a built in adhesion promoter.

Note: These materials (except for PI-2574) require the use of an adhesion promoter.

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