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Hitachi Chemical

Products by Processing Technology

Polyimides and PBOs are high temperature engineering polymers that exhibit an exceptional combination of thermal stability (>500°C), mechanical toughness and chemical resistance. In addition, they have excellent dielectric properties. Because of their high degree of ductility and inherently low CTE, these polymers can be readily implemented into a variety of microelectronic applications.

We offer a broad line of photodefinable or standard (non-photodefinable) products and ancillaries:

Photodefineable

Photodefineable materials can be patterned directly by exposure to UV light. They can either harden with exposure (negative acting) or soften with exposure (positive acting). The softer areas are then removed with either:

Solvent developer systems (Negative - solvent processing)  Aqueous developer systems (Positive - aqueous processing)

Non-photodefinable Polyimides

Non-photodefinable materials are patterned by applying a photoresist or other type of mask and removing the polyimide either by:

Non-photodefineable (Plasma Etch - Dry Etching) Non-photodefineable (Photoresist Developer - Wet Etching) Non-photodefineable, Adhesives

* Requires the use of an adhesion promoter
† Solvent Negative requires developer and rinse ancillary

Note: HDM is limiting the availability of small volume orders to our most popular products in each product category. Contact HDM Customer Service if you are interested in a product not listed. 

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