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Hitachi Chemical

Products by Processing Technology

After our customers apply and cure our liquid chemistries, they become Polyimide and PBO films that are high temperature engineering polymers which exhibit an exceptional combination of thermal stability (>500°C), mechanical toughness and chemical resistance. In addition, they have excellent dielectric properties. Because of their high degree of ductility and inherently low CTE, these cured films can be readily implemented into a variety of microelectronic applications.

We offer a broad line of photodefinable or standard (non-photodefinable) products and ancillaries:


Photodefineable materials can be patterned directly by exposure to UV light. They can either harden with exposure (negative acting) or soften with exposure (positive acting). The softer areas are then removed with either:

Solvent developer systems (Negative - solvent processing)  Aqueous developer systems (Positive - aqueous processing)


Non-photodefinable materials are patterned by applying a photoresist or other type of mask and removing the polyimide either by:

Non-photodefineable (Plasma Etch - Dry Etching) Non-photodefineable (Photoresist Developer - Wet Etching) Non-photodefineable, Adhesives

* Requires the use of an adhesion promoter
† Solvent Negative requires developer and rinse ancillary

Note: HDM is limiting the availability of small volume orders to our most popular products in each product category. Contact HDM Customer Service if you are interested in a product not listed. 

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