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November 22, 2010
HD MicroSystems Successfully registers n-methyl-pyrrolidone (NMP) with European Authorities

N-methyl-pyrrolidone (NMP) is the base solvent in many HDM products. HDM has completed the necessary documentation to assure continued supply of our materials in Europe required under REACH legislation. 
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February 2, 2010
DuPont Presents at IMAPS Device Packaging Workshop

DuPont will present two technical papers in addition to highlighting its material offerings for Wafer Level Packaging at the sixth annual IMAPS Device Packaging Workshop, March 9 - 11, 2010 at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona. » More

January 29, 2010
HD Microsystems Sponsors Symposium on Polymers

The Symposium has become one of the most comprehensive meetings held on the implementation and the processing of polyimides and new polymeric materials in advanced semiconductor, electronic packaging and assembly applications. » More

May 21, 2009
HD MicroSystems™ Introduces HD-8930 Ultra-Low Cure PBO for Wafer Level Semiconductor Packaging

The new offering is the latest in the HD‑8900 low-cure PBO series and combines the proven reliability of HD MicroSystems’ PBO technology with curing temperatures as low as 200°C. With its low modulus and high elongation, HD‑8930 achieves superior drop test results, making it ideal for use in portable electronic devices. » More 

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